J. Eckermann, S. Mehmood, H. M. Davies, N. P. Lavery, S. G. R. Brown, J. Sienz, A. Jones, P. Sommerfeld. Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. Microelectronics Reliability, 54(6-7):1235-1242, 2014. [doi]
@article{EckermannMDLBSJS14,
title = {Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys},
author = {J. Eckermann and S. Mehmood and H. M. Davies and N. P. Lavery and S. G. R. Brown and J. Sienz and A. Jones and P. Sommerfeld},
year = {2014},
doi = {10.1016/j.microrel.2014.02.017},
url = {http://dx.doi.org/10.1016/j.microrel.2014.02.017},
researchr = {https://researchr.org/publication/EckermannMDLBSJS14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {6-7},
pages = {1235-1242},
}