TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Ashkan Eghbal, Pooria M. Yaghini, Siavash S. Yazdi, Nader Bagherzadeh. TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip. In 2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2014, Amsterdam, The Netherlands, October 1-3, 2014. pages 92-97, IEEE, 2014. [doi]

This author has not been identified. Look up 'Ashkan Eghbal' in GoogleThis author has not been identified. Look up 'Pooria M. Yaghini' in GoogleThis author has not been identified. Look up 'Siavash S. Yazdi' in GoogleThis author has not been identified. Look up 'Nader Bagherzadeh' in Google

runs on WebDSL