Ashkan Eghbal, Pooria M. Yaghini, Siavash S. Yazdi, Nader Bagherzadeh. TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip. In 2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2014, Amsterdam, The Netherlands, October 1-3, 2014. pages 92-97, IEEE, 2014. [doi]
Abstract is missing.