Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations

Gordon Elger, Shri Vishnu Kandaswamy, E. Liu, Alexander Hanss, Maximilian Schmid, Robert Derix, Fosca Conti. Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectronics Journal, 46(12):1230-1238, 2015. [doi]

Abstract

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