A. Elsayed, Clement Godfrin, Nard I. Dumoulin Stuyck, M. M. K. Shehata, Stefan Kubicek, S. Massar, Yann Canvel, Julien Jussot, Andriy Hikavyy, Roger Loo, George Simion, Massimo Mongillo, D. Wan, Bogdan Govoreanu, R. Li, Iuliana P. Radu, P. Van Dorpe, Kristiaan De Greve. Comprehensive 300 mm process for Silicon spin qubits with modular integration. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]
@inproceedings{ElsayedGSSKMCJH23,
title = {Comprehensive 300 mm process for Silicon spin qubits with modular integration},
author = {A. Elsayed and Clement Godfrin and Nard I. Dumoulin Stuyck and M. M. K. Shehata and Stefan Kubicek and S. Massar and Yann Canvel and Julien Jussot and Andriy Hikavyy and Roger Loo and George Simion and Massimo Mongillo and D. Wan and Bogdan Govoreanu and R. Li and Iuliana P. Radu and P. Van Dorpe and Kristiaan De Greve},
year = {2023},
doi = {10.23919/VLSITechnologyandCir57934.2023.10185272},
url = {https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185272},
researchr = {https://researchr.org/publication/ElsayedGSSKMCJH23},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023},
publisher = {IEEE},
isbn = {978-4-86348-806-9},
}