Comprehensive 300 mm process for Silicon spin qubits with modular integration

A. Elsayed, Clement Godfrin, Nard I. Dumoulin Stuyck, M. M. K. Shehata, Stefan Kubicek, S. Massar, Yann Canvel, Julien Jussot, Andriy Hikavyy, Roger Loo, George Simion, Massimo Mongillo, D. Wan, Bogdan Govoreanu, R. Li, Iuliana P. Radu, P. Van Dorpe, Kristiaan De Greve. Comprehensive 300 mm process for Silicon spin qubits with modular integration. In 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), Kyoto, Japan, June 11-16, 2023. pages 1-2, IEEE, 2023. [doi]

Abstract

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