Paul Enquist, G. Fountain, C. Petteway, A. Hollingsworth, H. Grady. Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]
Abstract is missing.