Furkan Eris, Ajay Joshi, Andrew B. Kahng, Yenai Ma, Saiful A. Mojumder, Tiansheng Zhang. Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon. In 2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018. pages 1441-1446, IEEE, 2018. [doi]
@inproceedings{ErisJKMMZ18,
title = {Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon},
author = {Furkan Eris and Ajay Joshi and Andrew B. Kahng and Yenai Ma and Saiful A. Mojumder and Tiansheng Zhang},
year = {2018},
doi = {10.23919/DATE.2018.8342238},
url = {https://doi.org/10.23919/DATE.2018.8342238},
researchr = {https://researchr.org/publication/ErisJKMMZ18},
cites = {0},
citedby = {0},
pages = {1441-1446},
booktitle = {2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018},
publisher = {IEEE},
isbn = {978-3-9819263-0-9},
}