Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri. 3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. J. Solid-State Circuits, 42(10):2270-2282, 2007. [doi]
Abstract is missing.