Wafer-Level Stacking of High-Density Capacitors to Enhance the Performance of a Large Multicore Processor for Machine Learning Applications - researchr publication authors

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Stephen Felix, Shannon Morton, Simon Stacey, John Walsh. Wafer-Level Stacking of High-Density Capacitors to Enhance the Performance of a Large Multicore Processor for Machine Learning Applications. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 424-425, IEEE, 2023. [doi]

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