Stephen Felix, Shannon Morton, Simon Stacey, John Walsh. Wafer-Level Stacking of High-Density Capacitors to Enhance the Performance of a Large Multicore Processor for Machine Learning Applications. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 424-425, IEEE, 2023. [doi]
@inproceedings{FelixMSW23,
title = {Wafer-Level Stacking of High-Density Capacitors to Enhance the Performance of a Large Multicore Processor for Machine Learning Applications},
author = {Stephen Felix and Shannon Morton and Simon Stacey and John Walsh},
year = {2023},
doi = {10.1109/ISSCC42615.2023.10067282},
url = {https://doi.org/10.1109/ISSCC42615.2023.10067282},
researchr = {https://researchr.org/publication/FelixMSW23},
cites = {0},
citedby = {0},
pages = {424-425},
booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
publisher = {IEEE},
isbn = {978-1-6654-9016-0},
}