Haigang Feng, Rouying Zhan, Guang Chen, Qiong Wu, Xiaokang Guan, Haolu Xie, Albert Z. Wang. Bonding-pad-oriented on-chip ESD protection structures for ICs. In ISCAS (3). pages 741-744, 2003. [doi]
@inproceedings{FengZCWGXW03,
title = {Bonding-pad-oriented on-chip ESD protection structures for ICs},
author = {Haigang Feng and Rouying Zhan and Guang Chen and Qiong Wu and Xiaokang Guan and Haolu Xie and Albert Z. Wang},
year = {2003},
doi = {10.1109/ISCAS.2003.1205670},
url = {http://dx.doi.org/10.1109/ISCAS.2003.1205670},
researchr = {https://researchr.org/publication/FengZCWGXW03},
cites = {0},
citedby = {0},
pages = {741-744},
booktitle = {ISCAS (3)},
}