Bonding-pad-oriented on-chip ESD protection structures for ICs

Haigang Feng, Rouying Zhan, Guang Chen, Qiong Wu, Xiaokang Guan, Haolu Xie, Albert Z. Wang. Bonding-pad-oriented on-chip ESD protection structures for ICs. In ISCAS (3). pages 741-744, 2003. [doi]

Abstract

Abstract is missing.