Bonding-pad-oriented on-chip ESD protection structures for ICs - researchr publication related

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Haigang Feng, Rouying Zhan, Guang Chen, Qiong Wu, Xiaokang Guan, Haolu Xie, Albert Z. Wang. Bonding-pad-oriented on-chip ESD protection structures for ICs. In ISCAS (3). pages 741-744, 2003. [doi]

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