Verification and Codesign of the Package and Die Power Delivery System Using Wavelets

Imad A. Ferzli, Eli Chiprout, Farid N. Najm. Verification and Codesign of the Package and Die Power Delivery System Using Wavelets. IEEE Trans. on CAD of Integrated Circuits and Systems, 29(1):92-102, 2010. [doi]

Abstract

Abstract is missing.