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ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness

Stefano de Filippis, Vladimír Kosel, Donald Dibra, Stefan Decker, Helmut Köck, Andrea Irace. ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness. Microelectronics Reliability, 51(9-11):1954-1958, 2011. [doi]

Authors

Stefano de Filippis

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Vladimír Kosel

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Donald Dibra

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Stefan Decker

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Helmut Köck

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Andrea Irace

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