ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness

Stefano de Filippis, Vladimír Kosel, Donald Dibra, Stefan Decker, Helmut Köck, Andrea Irace. ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness. Microelectronics Reliability, 51(9-11):1954-1958, 2011. [doi]

Abstract

Abstract is missing.