Stefano de Filippis, Vladimír Kosel, Donald Dibra, Stefan Decker, Helmut Köck, Andrea Irace. ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness. Microelectronics Reliability, 51(9-11):1954-1958, 2011. [doi]
@article{FilippisKDDKI11,
title = {ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness},
author = {Stefano de Filippis and Vladimír Kosel and Donald Dibra and Stefan Decker and Helmut Köck and Andrea Irace},
year = {2011},
doi = {10.1016/j.microrel.2011.06.047},
url = {http://dx.doi.org/10.1016/j.microrel.2011.06.047},
researchr = {https://researchr.org/publication/FilippisKDDKI11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {9-11},
pages = {1954-1958},
}