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Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing

Robert Fischbach, Tilman Horst, Jens Lienig. Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2019, Florence, Italy, March 25-29, 2019. pages 956-959, IEEE, 2019. [doi]

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Robert Fischbach

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Tilman Horst

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Jens Lienig

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