Robert Fischbach, Tilman Horst, Jens Lienig. Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2019, Florence, Italy, March 25-29, 2019. pages 956-959, IEEE, 2019. [doi]
@inproceedings{FischbachHL19,
title = {Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing},
author = {Robert Fischbach and Tilman Horst and Jens Lienig},
year = {2019},
doi = {10.23919/DATE.2019.8714884},
url = {https://doi.org/10.23919/DATE.2019.8714884},
researchr = {https://researchr.org/publication/FischbachHL19},
cites = {0},
citedby = {0},
pages = {956-959},
booktitle = {Design, Automation & Test in Europe Conference & Exhibition, DATE 2019, Florence, Italy, March 25-29, 2019},
publisher = {IEEE},
isbn = {978-3-9819263-2-3},
}