Benjamin J. Fletcher, Shidhartha Das, Terrence S. T. Mak. A Low-Energy Inductive Transceiver using Spike-Latency Encoding for Wireless 3D Integration. In 2019 IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2019, Lausanne, Switzerland, July 29-31, 2019. pages 1-6, IEEE, 2019. [doi]
Abstract is missing.