Low-power 3D integration using inductive coupling links for neurotechnology applications - researchr publication authors

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Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak. Low-power 3D integration using inductive coupling links for neurotechnology applications. In 2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018. pages 1211-1216, IEEE, 2018. [doi]

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