Benjamin J. Fletcher, Shidhartha Das, Chi-Sang Poon, Terrence S. T. Mak. Low-power 3D integration using inductive coupling links for neurotechnology applications. In 2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018. pages 1211-1216, IEEE, 2018. [doi]
@inproceedings{FletcherDPM18,
title = {Low-power 3D integration using inductive coupling links for neurotechnology applications},
author = {Benjamin J. Fletcher and Shidhartha Das and Chi-Sang Poon and Terrence S. T. Mak},
year = {2018},
doi = {10.23919/DATE.2018.8342200},
url = {https://doi.org/10.23919/DATE.2018.8342200},
researchr = {https://researchr.org/publication/FletcherDPM18},
cites = {0},
citedby = {0},
pages = {1211-1216},
booktitle = {2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018},
publisher = {IEEE},
isbn = {978-3-9819263-0-9},
}