MMIC-I: A Robotic Platform for Assembly Integration and Internal Locomotion through Mechanical Meta-Material Structures

Olivia Formoso, Greenfield Trinh, Damiana Catanoso, In-Won Park, Christine Gregg, Kenneth Cheung. MMIC-I: A Robotic Platform for Assembly Integration and Internal Locomotion through Mechanical Meta-Material Structures. In IEEE International Conference on Robotics and Automation, ICRA 2023, London, UK, May 29 - June 2, 2023. pages 7303-7309, IEEE, 2023. [doi]

Authors

Olivia Formoso

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Greenfield Trinh

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Damiana Catanoso

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In-Won Park

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Christine Gregg

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Kenneth Cheung

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