Olivia Formoso, Greenfield Trinh, Damiana Catanoso, In-Won Park, Christine Gregg, Kenneth Cheung. MMIC-I: A Robotic Platform for Assembly Integration and Internal Locomotion through Mechanical Meta-Material Structures. In IEEE International Conference on Robotics and Automation, ICRA 2023, London, UK, May 29 - June 2, 2023. pages 7303-7309, IEEE, 2023. [doi]
@inproceedings{FormosoTCPGC23,
title = {MMIC-I: A Robotic Platform for Assembly Integration and Internal Locomotion through Mechanical Meta-Material Structures},
author = {Olivia Formoso and Greenfield Trinh and Damiana Catanoso and In-Won Park and Christine Gregg and Kenneth Cheung},
year = {2023},
doi = {10.1109/ICRA48891.2023.10161263},
url = {https://doi.org/10.1109/ICRA48891.2023.10161263},
researchr = {https://researchr.org/publication/FormosoTCPGC23},
cites = {0},
citedby = {0},
pages = {7303-7309},
booktitle = {IEEE International Conference on Robotics and Automation, ICRA 2023, London, UK, May 29 - June 2, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2365-8},
}