On-Die Interconnect and Other Challenges for Chip-Level Multi-Processing

Tryggve Fossum. On-Die Interconnect and Other Challenges for Chip-Level Multi-Processing. In John W. Lockwood, Fabrizio Petrini, Ron Brightwell, Dhabaleswar K. Panda, editors, 15th Annual IEEE Symposium on High-Performance Interconnects, HOTI 2007, Stanford, CA, USA, August 22-24, 2007. pages 4, IEEE Computer Society, 2007. [doi]

Abstract

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