Hua-Cheng Fu, Shi-Yu Huang, Ding-Ming Kwai, Yung-Fa Chou. Temperature-aware online testing of power-delivery TSVs. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.