An intelligent thermo-mechanical coupling collaborative design technique for 2.5D chiplet heterogeneous integration (CHI) system

Yu Fu, Guoliang Li, Guangbao Shan, Zeyu Chen, Hongrui Zhao, Yintang Yang. An intelligent thermo-mechanical coupling collaborative design technique for 2.5D chiplet heterogeneous integration (CHI) system. Microelectronics Journal, 165:106801, 2025. [doi]

Abstract

Abstract is missing.