Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang-Wook Lee, Mitsumasa Koyanagi. Development of via-last 3D integration technologies using a new temporary adhesive system. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]
Abstract is missing.