Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi. Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]
@inproceedings{FukushimaIMBLCT14,
title = {Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration},
author = {Takafumi Fukushima and Yuka Ito and Mariappan Murugesan and Jicheol Bea and Kang-Wook Lee and Koji Choki and Tetsu Tanaka and Mitsumasa Koyanagi},
year = {2014},
doi = {10.1109/3DIC.2014.7152145},
url = {http://dx.doi.org/10.1109/3DIC.2014.7152145},
researchr = {https://researchr.org/publication/FukushimaIMBLCT14},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014},
publisher = {IEEE},
isbn = {978-1-4799-8472-5},
}