Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi. Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-4, IEEE, 2014. [doi]
Abstract is missing.