Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing - researchr publication authors

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Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan. Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]

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