Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan. Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-4, IEEE, 2021. [doi]
@inproceedings{FukushimaSTHBMK21,
title = {Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing},
author = {Takafumi Fukushima and Shinichi Sakuyama and Masatomo Takahashi and Hiroyuki Hashimoto and Jichoel Bea and Theodorus Marcello and Hisashi Kino and Tetsu Tanaka and Mitsumasa Koyanagi and Mariappan Murugesan},
year = {2021},
doi = {10.1109/3DIC52383.2021.9687601},
url = {https://doi.org/10.1109/3DIC52383.2021.9687601},
researchr = {https://researchr.org/publication/FukushimaSTHBMK21},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021},
publisher = {IEEE},
isbn = {978-1-6654-1706-8},
}