Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations - researchr publication authors

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Ayano Furue, Satoshi Matsumoto. Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]

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