Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations

Ayano Furue, Satoshi Matsumoto. Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]

@inproceedings{FurueM21,
  title = {Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations},
  author = {Ayano Furue and Satoshi Matsumoto},
  year = {2021},
  doi = {10.1109/3DIC52383.2021.9687610},
  url = {https://doi.org/10.1109/3DIC52383.2021.9687610},
  researchr = {https://researchr.org/publication/FurueM21},
  cites = {0},
  citedby = {0},
  pages = {1-5},
  booktitle = {IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021},
  publisher = {IEEE},
  isbn = {978-1-6654-1706-8},
}