Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs - researchr publication authors

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Kaoru Furumi, Masashi Imai, Atsushi Kurokawa. Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs. In 18th International Symposium on Quality Electronic Design, ISQED 2017, Santa Clara, CA, USA, March 14-15, 2017. pages 283-288, IEEE, 2017. [doi]

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