Kaoru Furumi, Masashi Imai, Atsushi Kurokawa. Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs. In 18th International Symposium on Quality Electronic Design, ISQED 2017, Santa Clara, CA, USA, March 14-15, 2017. pages 283-288, IEEE, 2017. [doi]
@inproceedings{FurumiIK17,
title = {Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs},
author = {Kaoru Furumi and Masashi Imai and Atsushi Kurokawa},
year = {2017},
doi = {10.1109/ISQED.2017.7918329},
url = {https://doi.org/10.1109/ISQED.2017.7918329},
researchr = {https://researchr.org/publication/FurumiIK17},
cites = {0},
citedby = {0},
pages = {283-288},
booktitle = {18th International Symposium on Quality Electronic Design, ISQED 2017, Santa Clara, CA, USA, March 14-15, 2017},
publisher = {IEEE},
isbn = {978-1-5090-5404-6},
}