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Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization

Andres Garcia, Nathan Warner, Nandika Dsouza, Enis Tuncer, Luu Nguyen, Marie Denison, Jeffrey T. Fong. Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. IEEE Transactions on Industrial Electronics, 63(11):7104-7111, 2016. [doi]

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Andres Garcia

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Nathan Warner

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Nandika Dsouza

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Enis Tuncer

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Luu Nguyen

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Marie Denison

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Jeffrey T. Fong

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