Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization

Andres Garcia, Nathan Warner, Nandika Dsouza, Enis Tuncer, Luu Nguyen, Marie Denison, Jeffrey T. Fong. Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. IEEE Transactions on Industrial Electronics, 63(11):7104-7111, 2016. [doi]

Abstract

Abstract is missing.