Andres Garcia, Nathan Warner, Nandika Dsouza, Enis Tuncer, Luu Nguyen, Marie Denison, Jeffrey T. Fong. Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. IEEE Transactions on Industrial Electronics, 63(11):7104-7111, 2016. [doi]
@article{GarciaWDTNDF16,
title = {Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization},
author = {Andres Garcia and Nathan Warner and Nandika Dsouza and Enis Tuncer and Luu Nguyen and Marie Denison and Jeffrey T. Fong},
year = {2016},
doi = {10.1109/TIE.2016.2585467},
url = {http://dx.doi.org/10.1109/TIE.2016.2585467},
researchr = {https://researchr.org/publication/GarciaWDTNDF16},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Industrial Electronics},
volume = {63},
number = {11},
pages = {7104-7111},
}