Mixed-Type Wafer Failure Pattern Recognition

Hao Geng, Qi Sun, Tinghuan Chen, Qi Xu, Tsung-Yi Ho, Bei Yu. Mixed-Type Wafer Failure Pattern Recognition. In Atsushi Takahashi 0001, editor, Proceedings of the 28th Asia and South Pacific Design Automation Conference, ASPDAC 2023, Tokyo, Japan, January 16-19, 2023. pages 727-732, ACM, 2023. [doi]

Abstract

Abstract is missing.