When Wafer Failure Pattern Classification Meets Few-shot Learning and Self-Supervised Learning

Hao Geng, Fan Yang, Xuan Zeng 0001, Bei Yu 0001. When Wafer Failure Pattern Classification Meets Few-shot Learning and Self-Supervised Learning. In IEEE/ACM International Conference On Computer Aided Design, ICCAD 2021, Munich, Germany, November 1-4, 2021. pages 1-8, IEEE, 2021. [doi]

@inproceedings{GengY0021,
  title = {When Wafer Failure Pattern Classification Meets Few-shot Learning and Self-Supervised Learning},
  author = {Hao Geng and Fan Yang and Xuan Zeng 0001 and Bei Yu 0001},
  year = {2021},
  doi = {10.1109/ICCAD51958.2021.9643518},
  url = {https://doi.org/10.1109/ICCAD51958.2021.9643518},
  researchr = {https://researchr.org/publication/GengY0021},
  cites = {0},
  citedby = {0},
  pages = {1-8},
  booktitle = {IEEE/ACM International Conference On Computer Aided Design, ICCAD 2021, Munich, Germany, November 1-4, 2021},
  publisher = {IEEE},
  isbn = {978-1-6654-4507-8},
}