Rituparna Ghosh, Anwesha Kanjilal, Praveen Kumar. Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. Microelectronics Reliability, 74:44-51, 2017. [doi]
@article{GhoshKK17,
title = {Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints},
author = {Rituparna Ghosh and Anwesha Kanjilal and Praveen Kumar},
year = {2017},
doi = {10.1016/j.microrel.2017.05.011},
url = {https://doi.org/10.1016/j.microrel.2017.05.011},
researchr = {https://researchr.org/publication/GhoshKK17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {74},
pages = {44-51},
}