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Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints

Rituparna Ghosh, Anwesha Kanjilal, Praveen Kumar. Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. Microelectronics Reliability, 74:44-51, 2017. [doi]

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