Innovative Practices Track: Test of 3D ICs & Chiplets

Sandeep Kumar Goel, Sandeep Pendharkar, Chunsheng Liu. Innovative Practices Track: Test of 3D ICs & Chiplets. In 40th IEEE VLSI Test Symposium, VTS 2022, San Diego, CA, USA, April 25-27, 2022. pages 1, IEEE, 2022. [doi]

Authors

Sandeep Kumar Goel

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Sandeep Pendharkar

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Chunsheng Liu

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