Sandeep Kumar Goel, Sandeep Pendharkar, Chunsheng Liu. Innovative Practices Track: Test of 3D ICs & Chiplets. In 40th IEEE VLSI Test Symposium, VTS 2022, San Diego, CA, USA, April 25-27, 2022. pages 1, IEEE, 2022. [doi]
@inproceedings{GoelPL22, title = {Innovative Practices Track: Test of 3D ICs & Chiplets}, author = {Sandeep Kumar Goel and Sandeep Pendharkar and Chunsheng Liu}, year = {2022}, doi = {10.1109/VTS52500.2021.9794242}, url = {https://doi.org/10.1109/VTS52500.2021.9794242}, researchr = {https://researchr.org/publication/GoelPL22}, cites = {0}, citedby = {0}, pages = {1}, booktitle = {40th IEEE VLSI Test Symposium, VTS 2022, San Diego, CA, USA, April 25-27, 2022}, publisher = {IEEE}, isbn = {978-1-6654-1060-1}, }