Multi-level modeling to OPC UA for migrating to Industry 4.0 in semiconductor manufacturing

Fahad R. Golra, Selma Azaiez, Marc Engel. Multi-level modeling to OPC UA for migrating to Industry 4.0 in semiconductor manufacturing. In IEEE Conference on Industrial Cyberphysical Systems, ICPS 2020, Tampere, Finland, June 10-12, 2020. pages 589-595, IEEE, 2020. [doi]

Abstract

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