DUO: Exposing On-Chip Redundancy to Rank-Level ECC for High Reliability

Seong-Lyong Gong, Jungrae Kim, Sangkug Lym, Michael Sullivan, Howard David, Mattan Erez. DUO: Exposing On-Chip Redundancy to Rank-Level ECC for High Reliability. In IEEE International Symposium on High Performance Computer Architecture, HPCA 2018, Vienna, Austria, February 24-28, 2018. pages 683-695, IEEE Computer Society, 2018. [doi]

@inproceedings{GongKLSDE18,
  title = {DUO: Exposing On-Chip Redundancy to Rank-Level ECC for High Reliability},
  author = {Seong-Lyong Gong and Jungrae Kim and Sangkug Lym and Michael Sullivan and Howard David and Mattan Erez},
  year = {2018},
  doi = {10.1109/HPCA.2018.00064},
  url = {http://doi.ieeecomputersociety.org/10.1109/HPCA.2018.00064},
  researchr = {https://researchr.org/publication/GongKLSDE18},
  cites = {0},
  citedby = {0},
  pages = {683-695},
  booktitle = {IEEE International Symposium on High Performance Computer Architecture, HPCA 2018, Vienna, Austria, February 24-28, 2018},
  publisher = {IEEE Computer Society},
  isbn = {978-1-5386-3659-6},
}