Multi-Partner Project: COIN-3D - Collaborative Innovation in 3D VLSI Reliability

George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou, Pavlos Stoikos, Olympia Axelou, Athanasios Tziouvaras, Georgios Karakonstantis, Tahani Aladwani, Christos Anagnostopoulos 0001, Yixian Shen, Anuj Pathania, Alberto GarcĂ­a Ortiz, George Floros 0002. Multi-Partner Project: COIN-3D - Collaborative Innovation in 3D VLSI Reliability. In Design, Automation & Test in Europe Conference, DATE 2026, Verona, Italy, April 20-22, 2026. pages 1-6, IEEE, 2026. [doi]

Abstract

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