Moishe Groger, Shadi M. Harb, Devin Morris, William R. Eisenstadt, Sudeep Puligundla. High speed I/O and thermal effect characterization of 3D stacked ICs. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
@inproceedings{GrogerHMEP09,
title = {High speed I/O and thermal effect characterization of 3D stacked ICs},
author = {Moishe Groger and Shadi M. Harb and Devin Morris and William R. Eisenstadt and Sudeep Puligundla},
year = {2009},
doi = {10.1109/3DIC.2009.5306528},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306528},
researchr = {https://researchr.org/publication/GrogerHMEP09},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}